86-0755-27838351
频率:32.768KHZ
尺寸:2.0x1.2mm
F2012,32.768KHZ晶振,F2012‐50‐9,2012mm,FCD-Tech晶振品牌,32.768KHZ,FCD-Tech无源晶振,F2012音叉晶体,两脚贴片晶振,F2012,F2012‐50‐9晶振,FCD-Tech荷兰晶体,陶瓷晶振,2012mm贴片晶振,32.768KHZ无源晶振,贴片谐振器,尺寸2.0x1.2mm,频率32.768KHZ,精度50ppm,负载9pF,高性能晶振,高可靠晶振,轻薄型晶振,环保晶振,无线应用晶振,工业设备晶振,实时时钟晶振,数码电子晶振.
F2012,32.768KHZ晶振,F2012‐50‐9,2012mm,FCD-Tech晶振品牌产品特点:
微型陶瓷SMD晶振封装,2个焊盘(可回流)
温度范围-40/+85°C(工业应用)
薄厚度0.6mm,优异的老化特性
应用:无线、商用和工业设备等应用.
F2012,32.768KHZ晶振,F2012‐50‐9,2012mm,FCD-Tech晶振品牌,32.768KHZ,FCD-Tech无源晶振,F2012音叉晶体,两脚贴片晶振,F2012,F2012‐50‐9晶振,FCD-Tech荷兰晶体,陶瓷晶振,2012mm贴片晶振,32.768KHZ无源晶振,贴片谐振器,尺寸2.0x1.2mm,频率32.768KHZ,精度50ppm,负载9pF,高性能晶振,高可靠晶振,轻薄型晶振,环保晶振,无线应用晶振,工业设备晶振,实时时钟晶振,数码电子晶振.
F2012,32.768KHZ晶振,F2012‐50‐9,2012mm,FCD-Tech晶振品牌产品特点:
微型陶瓷SMD晶振封装,2个焊盘(可回流)
温度范围-40/+85°C(工业应用)
薄厚度0.6mm,优异的老化特性
应用:无线、商用和工业设备等应用.
F2012,F2012‐50‐9,2012mm,FCD-Tech晶振品牌 参数表
Parameter | min. | typ. | max. | Unit | Condi?on | ||||||||||
Frequency | 32.768 | KHz | |||||||||||||
Vibra?on mode | XY‐cut | ||||||||||||||
Frequency stability | |||||||||||||||
Ini?al tolerance @25°C | ±20, ±50 | ppm | |||||||||||||
Opera?ng temperature range | ‐40 | +85 | °C | ||||||||||||
Turnover temperature Parabolic curvature constant |
25°C ±5 °C ‐0.045x10‐6/°C2 max. |
||||||||||||||
Equivalent Series Resistance (ESR) | 90K? max. | ||||||||||||||
Load Capacitance (CL) | Standard: 12.5pF ( 9pF, 7pF op?onal) | ||||||||||||||
Shunt Capacitance (Co) | 2.0 | pF | |||||||||||||
Drive Level | 0.1 | µW | |||||||||||||
Aging | ±3 | ppm | At 25°C, ?rst year | ||||||||||||
Insula?on Resistance | 500 | M? | @ 100Vdc | ||||||||||||
Enclosure (see drawing) (LxWxH) | 2.0 x 1.2 x 0.6 | mm | |||||||||||||
Packing | 3000 pcs per reel |
F2012,F2012‐50‐9,2012mm,FCD-Tech晶振品牌 尺寸图
电话:+86-0755-27838351
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