Rakon瑞康新一代晶体振荡器技术深度解析
Rakon瑞康新一代晶体振荡器的核心革新,在于摒弃传统分立电路设计,采用自研专属ASIC专用集成电路+XMEMS®精密谐振单元+Kelvin™高精度测温传感的一体化集成架构,将传统晶振需要数十颗分立元器件实现的全部功能,高度集成至单颗定制ASIC芯片内部,实现时钟信号产生,温度采集,智能补偿,频率校准,稳压滤波,信号整形,功耗管控,故障纠错的全流程单芯片闭环控制,从硬件底层重构精密时序器件的工作逻辑.
不同于通用商用芯片,RakonMercury+™,Pluto+™系列ASIC芯片是专为高精度晶振量身定制的专用集成电路,针对性优化时序运算,温度补偿,低噪声处理算法,完全适配高端TCXO,OCXO的精密工作需求.其中Pluto+™ASIC主打高性价比精密温补时序场景,适配工业,导航,常规通信设备;Mercury+™ASIC定位军工级,仪器级超高精度恒温时序场景,主打极致低噪声,超高稳定,超低老化漂移,是高端OCXO的核心核心主控芯片.
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