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频率:60MHZ
尺寸:3.2x2.5mm
F3225A-20-25-F‐30-3-60.000MHz FCD-Tech无源晶体 6G移动通信晶振,尺寸为3.2x2.5mm,频率60MHZ,荷兰进口晶振,小体积无源晶体,石英贴片晶振,SMD晶振,石英晶振,无源贴片晶振,石英晶体谐振器,水晶振动子,绿色环保晶振,四脚贴片晶振,轻薄型晶体,6G移动通信专用晶振,无线应用晶振,GPS全球定位系统晶振,蓝牙专用晶振,网络设备晶振,智能家居晶振,仪器仪表专用晶振,平板电脑晶振,具有轻薄小,高可靠性能的特点,适合用于无线应用,蓝牙,GPS等领域.
F3225A是一款采用小型薄型封装的陶瓷4焊盘SMD晶振,尺寸为3.2x2.5x0.8mm。基频模式的频率范围为10 MHz至60MHz,三次泛音频率范围为60MHz至156.250MHz。低阻抗性能。F3225A-20-25-F‐30-3-60.000MHz FCD-Tech无源晶体 6G移动通信晶振.
F3225A-20-25-F‐30-3-60.000MHz FCD-Tech无源晶体 6G移动通信晶振,尺寸为3.2x2.5mm,频率60MHZ,荷兰进口晶振,小体积无源晶体,石英贴片晶振,SMD晶振,石英晶振,无源贴片晶振,石英晶体谐振器,水晶振动子,绿色环保晶振,四脚贴片晶振,轻薄型晶体,6G移动通信专用晶振,无线应用晶振,GPS全球定位系统晶振,蓝牙专用晶振,网络设备晶振,智能家居晶振,仪器仪表专用晶振,平板电脑晶振,具有轻薄小,高可靠性能的特点,适合用于无线应用,蓝牙,GPS等领域.
F3225A是一款采用小型薄型封装的陶瓷4焊盘SMD晶振,尺寸为3.2x2.5x0.8mm。基频模式的频率范围为10 MHz至60MHz,三次泛音频率范围为60MHz至156.250MHz。低阻抗性能。F3225A-20-25-F‐30-3-60.000MHz FCD-Tech无源晶体 6G移动通信晶振.
F3225A-20-25-F‐30-3-60.000MHz FCD-Tech无源晶体 6G移动通信晶振 参数表
Parameter | min. | typ. | max. | Unit | Condition | ||||||||||
Frequency range | 10.000 | 60.000 | MHz | Fundamental mode | |||||||||||
60.000 |
|
MHz | 3rd overtone | ||||||||||||
Vibration mode | AT cut, fundamental, 3rd overtone | ||||||||||||||
Frequency stability | |||||||||||||||
Initial tolerance @25°C | ±30 | ppm | See options | ||||||||||||
vs. operating temperature range | ±30 | ppm | See options | ||||||||||||
operating temperature range | ‐10 | +60 | °C | See options | |||||||||||
Equivalent Series Resistance (ESR) | See table 1 | ||||||||||||||
Load Capacitance (CL) | Series or 8pF to 32pF (see options) | ||||||||||||||
Shunt Capacitance (Co) | 3.5 | pF | |||||||||||||
Drive Level | 200 | µW | |||||||||||||
Aging | ±2 | ppm | At 25°C, ?rst year | ||||||||||||
Insulation Resistance | 500 | M? | @ 100Vdc | ||||||||||||
Enclosure (see drawing) (LxWxH) | 3.2 x 2.5 x 0.8 | mm | |||||||||||||
Soldering Condition | 260°C, 10 sec x 2 max. | ||||||||||||||
Packing | 3,000 pcs./reel |
石英晶振产品特性:
超薄微型4焊盘SMD晶体封装
全密封型,金属外壳密封在陶瓷板上
低阻抗性能
频率范围10MHZ- 156.25MHZ
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