全站搜索 - s - 康华尔电子-进口晶振一站式解决专家爱普生晶振,KDS晶振,京瓷晶振

康华尔电子-中国供应商

KONUAER NIHON DEMPA KOGYO CO., LTD.

客户至上—进口晶振品牌选择康华尔

深圳市康华尔电子有限公司

专营晶振二十年

全国统一服务热线：

86-0755-27838351

康华尔电子成立至今已有20多年,是国内数一数二的晶振厂家0755-27838351,专业研发生产销售石英晶振,32.768K晶振,石英晶体谐振器,贴片晶振,SAW滤波器等.采用无铅环保材料生产,具有精度稳定,小体积,重量轻等特点.国产晶振就选康华尔电子,质量好,精度高,价格优势.

康华尔电子多年来在竞争激烈的市场中,以技术占领市场,以质量赢得客户,是国内口碑极高的晶振供应商.并且凭借自身的努力代理台湾进口晶振多个品牌,TXC晶振,鸿星晶振,加高晶振,亚陶晶振等.康华尔电子所提供的台产晶振,均符合德国ROHS环保指令,具有高质量,高可靠使用特性,咨询选购热线0755-27838351.

日本进口晶振在国内口碑一流,高端智能产品使用晶振大都会选择日产晶振作为首选.康华尔电子凭借自身的努力同时代理KDS晶振,爱普生晶振,精工晶体,京瓷晶振等品牌.所代理石英晶振,石英晶体振荡器,贴片晶体均符合欧盟ROHS环保要求,具有高精度,高品质,低插损,耐高温等特点.

康华尔电子是国内优秀的欧美进口晶振供货商0755-27838351,多年来凭借自身的努力,获得CTS晶振,FOX晶振,Sitime晶振,瑞康晶振等代理权限.所代理进口晶振,欧美晶振均符合欧盟ROHS环保指令,并且获得ISO国际质量管理体系认证.市场常用进口晶振封装型号康华尔电子均有备货,可免费提供现货样品以及晶振技术解决方案.

32.768K是晶振频率中最容易让人记住的数字,32.768K晶振素来有时钟晶振的称谓,只要跟数字显示以及时间相关的产品都少不了一款32.768K晶振.根据不同的产品需求主要分为圆柱晶振和32.768K贴片晶振.常见封装有2x6,3x8,7.0x1.5,3.2x1.5,2.0x1.2等体积.康华尔电子提供各种32.768K晶振,音叉表晶,价格优质,咨询热线0755-27838351.

有源晶振是一款自身带有电源电压功能的石英晶体振荡器,并且有多种电压供选择,比如有1.8V,2.5V,3.3V,3.8V,5V等高速自动安装和高温回流焊设计,Optionable待机输出三态输出功能,电源电压范围：1.8V~5 V,高稳定性,低抖动,低功耗,主要应用领域:无线通讯,高端智能手机,平板笔记本WLAN,蓝牙,数码相机,DSL和其他IT产品的晶振应用,三态功能,PC和LCDM等高端数码领域,符合RoHS/无铅.

康华尔电子拥有先进的设备,一流的生产技术,致力于为用户提供小型,薄型,高精密石英晶振,贴片晶体,石英晶体振荡器.多年来康华尔电子通过自身努力,获得多个进口贴片晶振品牌代理权限,比如,KDS晶振,NDK晶振,京瓷晶振,TXC晶振,鸿星晶振,CTS晶振,IDT晶振等.康华尔进口晶振代理商,所提供产品均符合国际ROHS环保指令,并且获得ISO9001国际认证,产品价格优势,交期快,咨询热线0755-27838351.

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热门关键词 : 石英晶振贴片晶振 32.768K晶振有源晶振 TXC晶振爱普生晶振 TCXO晶振 KDS晶振泰艺晶振 CTS晶振

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: KDS晶振,贴片晶振,DSX321G晶振,1C326000AB0AR晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">智能手机晶振,产品具有高精度超小型的表面贴片型石英晶体谐振器,适用于移动通信终端的基准时钟等移动通信领域.比如智能手机,无线通信,卫星导航,平台基站等较高端的数码产品,span>style="font-size:16px"><span style="color:#ff0000">3225晶体谐振器span><span style="font-size:16px">本身小型,薄型具备各类移动通信的基准时钟源用频率,贴片晶振具有优良的电气特性,耐环境性能适用于移动通信领域,满足无铅焊接的高温回流温度曲线要求.span>span>span>span>span>span>span>span>span>span>span>span>span>span>span>span>span>span>span>
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: KDS晶振,贴片晶振,DSX221G晶振,1ZCB26000LB0B晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">超小型表面贴片型span>style="font-size:16px"><span style="color:#ff0000">SMD晶振span><span style="font-size:16px">,最适合使用在汽车电子领域中,也是特别要求高可靠性的引擎控制用CPU的时钟部分.低频晶振可从12MHz起对应,小型,超薄型具备强防焊裂性,石英晶体在极端严酷的环境条件下也能发挥稳定的起振特性,产品本身具有耐热,耐振,耐撞击等优良的耐环境特性,满足无铅焊接以及高温回流温度曲线要求,符合AEC-Q200标准.span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,贴片晶振,DSX211G晶振,1ZZCAA32000BB0F晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">小型贴片石英晶振,外观尺寸具有薄型表面贴片型span>style="font-size:16px"><span style="color:#ff0000">石英晶体谐振器span><span style="font-size:16px">,特别适用于有小型化要求的市场领域,比如智能手机,无线蓝牙,平板电脑等电子数码产品.晶振本身超小型,薄型,重量轻,晶体具有优良的耐环境特性,如耐热性,耐冲击性,在办公自动化,家电相关电器领域及Bluetooth,Wireless LAN等短距离无线通信领域可发挥优良的电气特性,满足无铅焊接的回流温度曲线要求.span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,声表面滤波器,DSF753SBF晶振,1D51610GQ1晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">贴片石英晶体,体积小,焊接可采用自动贴片系统,产品本身小型,表面span>style="font-size:16px"><span style="color:#ff0000">SMD晶振span><span style="font-size:16px">,特别适用于有小型化要求的电子数码产品市场领域,因产品小型,薄型优势,耐环境特性,包括耐高温,耐冲击性等,在移动通信领域得到了广泛的应用,晶振产品本身可发挥优良的电气特性,满足无铅焊接的高温回流温度曲线要求span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,声表面滤波器,DSF753SDF晶振,1D44812GQ12晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">小型贴片石英晶振,外观尺寸具有薄型表面贴片型石英晶体振荡器,特别适用于有小型化要求的市场领域,比如智能手机,无线蓝牙,平板电脑等电子数码产品.晶振本身超小型,薄型,重量轻,span>style="font-size:16px"><span style="color:#ff0000">7050晶振span><span style="font-size:16px">具有优良的耐环境特性,如耐热性,耐冲击性,在办公自动化,家电相关电器领域及Bluetooth,Wireless LAN等短距离无线通信领域可发挥优良的电气特性,满足无铅焊接的回流温度曲线要求.span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,声表面滤波器,DSF753SAF晶振,1D21407AQ3晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">小型贴片石英晶振,外观尺寸具有薄型表面贴片型石英晶体振荡器,特别适用于有小型化要求的市场领域,比如智能手机,无线蓝牙,平板电脑等电子数码产品.晶振本身超小型,薄型,重量轻,span>style="font-size:16px"><span style="color:#ff0000">7050晶振span><span style="font-size:16px">具有优良的耐环境特性,如耐热性,耐冲击性,在办公自动化,家电相关电器领域及Bluetooth,Wireless LAN等短距离无线通信领域可发挥优良的电气特性,满足无铅焊接的回流温度曲线要求.span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,有源晶振,DSO321SR晶振,1XSE013000AR7晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">style="font-size:16px"><span style="color:#ff0000">32.768K晶振span><span style="font-size:16px">具有小型,薄型,轻型的贴片晶振表面音叉型晶体振荡器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定,满足无铅焊接的高温回流温度曲线要求,金属外壳的封装使得产品在封装时能发挥比陶瓷谐振器外壳更好的耐冲击性.span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,有源晶振,DSO221SHF晶振,1XSF012288EH1晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">2520mm体积的石英晶体振荡器span>style="font-size:16px"><span style="color:#ff0000">有源晶振span><span style="font-size:16px">,改产品可驱动2.5V的温补晶振,压控晶振,VC-TCXO晶体振荡器产品,电源电压的低电耗型,编带包装方式,可对应自动高速贴片机自动焊接,及IR回流焊接（无铅对应）,为无铅产品,超小型,质地轻.产品被广泛应用到集成电路,程控交换系统,无线发射基站.span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,有源晶振,DSO221SR晶振,1XSF006140AR晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">2520mm体积的晶振,可以说是目前小型数码产品的福音,目前超小型的智能手机里面所应用的就是小型的span>style="font-size:16px"><span style="color:#ff0000">石英晶振span><span style="font-size:16px">,该产品最适用于无线通讯系统,无线局域网,已实现低相位噪声,低电压,低消费电流和高稳定度,超小型,质量轻等产品特点,产品本身编带包装方式,可对应自动高速贴片机应用,以及高温回流焊接（产品无铅对应）,为无铅产品.span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,热敏晶振,DSR221STH晶振,1MAA19200ACA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">普通石英晶振,外观完全使用金属材料封装的,产品本身采用全自动石英晶体检测仪,以及跌落,漏气等苛刻实验.产品本身具有高稳定性,高可靠性的石英晶体振荡器,焊接方面支持表面贴装,外观采用金属封装,具有充分的密封性能,span>style="font-size:16px"><span style="color:#ff0000">低消耗晶振span><span style="font-size:16px">本身能确保其高可靠性,采用编带包装,可对应产品应用到自动贴片机高速安装,满足无铅焊接的高温回流温度曲线要求.span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,热敏晶振,DSR211ATH晶振,1RAE19200BAA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">普通石英晶振,外观完全使用金属材料封装的,产品本身采用全自动石英晶体检测仪,以及跌落,漏气等苛刻实验.产品本身具有高稳定性,高可靠性的石英晶体振荡器,焊接方面支持表面贴装,外观采用金属封装,具有充分的密封性能,span>style="font-size:16px"><span style="color:#ff0000">低消耗晶振span><span style="font-size:16px">本身能确保其高可靠性,采用编带包装,可对应产品应用到自动贴片机高速安装,满足无铅焊接的高温回流温度曲线要求.span>span><span style="font-size:16px">span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,温补晶振,DSB221SDM晶振,1XXB16368JFA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">智能手机晶振,产品具有高精度超小型的表面贴片型石英晶体振荡器,最适用于移动通信终端的基准时钟等移动通信领域.比如智能手机,无线通信,卫星导航,平台基站等较高端的数码产品,span>style="font-size:16px"><span style="color:#ff0000">温补晶振span><span style="font-size:16px">本身小型,薄型具备各类移动通信的基准时钟源用频率,贴片晶振具有优良的电气特性,耐环境性能适用于移动通信领域,满足无铅焊接的高温回流温度曲线要求.span>span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,温补晶振,DSB221SJ晶振,1XXB12288EAA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">style="font-size:16px"><span style="color:#ff0000">2520石英晶振span><span style="font-size:16px">适用于汽车电子领域的表面贴片型石英晶振,本产品已被确定的高信赖性最适合用于汽车电子部件,晶体在极端严酷的环境条件下也能发挥稳定的起振特性,晶振本身具有耐热,耐振,耐冲击等优良的耐环境特性,满足无铅焊接的高温回流温度曲线要求,符合AEC-Q200标准.span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,温补晶振,DSB221SCM晶振,1XXD38400HCA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">小型贴片石英晶振,外观尺寸是薄型表面span>style="font-size:16px"><span style="color:#ff0000">SMD晶体振荡器span><span style="font-size:16px">,特别适用于有小型化要求的市场领域,比如智能手机,无线蓝牙,平板电脑等电子数码产品.晶振本身超小型,薄型,重量轻,晶体具有优良的耐环境特性,如耐热性,耐冲击性,在办公自动化,家电相关电器领域及Bluetooth,Wireless LAN等短距离无线通信领域可发挥优良的电气特性,满足无铅焊接的回流温度曲线要求.span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,温补晶振,DSB211SDM晶振,1XXD16367JAA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">贴片石英晶体,体积小,焊接可采用自动贴片系统,产品本身小型,表面span>style="font-size:16px"><span style="color:#ff0000">SMD晶振span><span style="font-size:16px">,特别适用于有小型化要求的电子数码产品市场领域,因产品小型,薄型优势,耐环境特性,包括耐高温,耐冲击性等,在移动通信领域得到了广泛的应用,晶振产品本身可发挥优良的电气特性,满足无铅焊接的高温回流温度曲线要求span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,压控温补晶振,DSA321SCL晶振,1XTV14745ABA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">贴片石英晶体,体积小,焊接可采用自动贴片系统,产品本身小型,表面span>style="font-size:16px"><span style="color:#ff0000">SMD晶振span><span style="font-size:16px">,特别适用于有小型化要求的电子数码产品市场领域,因产品小型,薄型优势,耐环境特性,包括耐高温,耐冲击性等,在移动通信领域得到了广泛的应用,晶振产品本身可发挥优良的电气特性,满足无铅焊接的高温回流温度曲线要求span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,压控温补晶振,DSA321SCM晶振,1XTV12800HCA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">贴片石英晶体,体积小,焊接可采用自动贴片系统,产品本身小型,表面span>style="font-size:16px"><span style="color:#ff0000">SMD晶振span><span style="font-size:16px">,特别适用于有小型化要求的电子数码产品市场领域,因产品小型,薄型优势,耐环境特性,包括耐高温,耐冲击性等,在移动通信领域得到了广泛的应用,晶振产品本身可发挥优良的电气特性,满足无铅焊接的高温回流温度曲线要求span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,差分晶振,DSA535SG晶振,1XTQ10000EGA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">TCXO晶振产品本身带温度补偿作用的晶体振荡器,该体积产品最适合于GPS,以及卫星通讯系统,智能电话等多用途的高稳定的频率温度特性span>style="font-size:16px"><span style="color:#ff0000">石英晶振span><span style="font-size:16px">.为对应低电源电压的产品.(DC+1.8V±0.1V to+2.9V±0.1V 对应IC可能) 高度：最高0.8 mm,体积：0.0022 cm3,重量：0.008 g,超小型,轻型.低消耗电流,表面贴片型产品span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,差分晶振,DSB535SD晶振,1XTR25000VAA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">5032mm体积的石英晶体振荡器有源晶振,改产品可驱动2.5V的span>style="font-size:16px"><span style="color:#ff0000">温补晶振span><span style="font-size:16px">,压控晶振,VC-TCXO晶体振荡器产品,电源电压的低电耗型,编带包装方式,可对应自动高速贴片机自动焊接,及IR回流焊接（无铅对应）,为无铅产品,超小型,质地轻.产品被广泛应用到集成电路,程控交换系统,无线发射基站.span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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: KDS晶振,压控温补晶振,DSA535SC晶振,1XTQ12800UBA晶振

<span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px"><span style="font-size:16px">5032mm体积的span>style="font-size:16px"><span style="color:#ff0000">差分贴片晶振span><span style="font-size:16px">,可以说是目前小型数码产品的福音,目前超小型的智能手机里面所应用的就是小型的石英晶振,该产品最适用于无线通讯系统,无线局域网,已实现低相位噪声,低电压,低消费电流和高稳定度,超小型,质量轻等产品特点,产品本身编带包装方式,可对应自动高速贴片机应用,以及高温回流焊接（产品无铅对应）,为无铅产品.span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>span><span style="font-size:16px">span>
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