6G无线通信晶振,加高陶瓷晶振,XSHO25000FC1H-H,HSX530G无源晶体

6G无线通信晶振,加高陶瓷晶振,XSHO25000FC1H-H,HSX530G无源晶体，尺寸5.0x3.2mm，频率25MHZ，HELE无源晶振，台湾贴片晶振，5032mm贴片晶体，陶瓷谐振器，水晶振动子，两脚贴片晶振，SMD无源晶振，绿色环保晶振，低功耗无源晶振，低损耗贴片晶振，高精度贴片晶振，高性能无源晶振，高品质贴片晶振，无线通信专用贴片晶振，智能手机专用晶振，可穿戴设备专用晶振，物联网专用晶振，数码相机专用晶振，视听设备晶振，轻薄型晶振，产品具有高精度高品质的特点。

SMD晶振产品比较常用于无线通信应用，智能手机，可穿戴设备，物联网，数码相机，视听设备等，还可以广泛用于数字视频，测试设备等领域.6G无线通信晶振,加高陶瓷晶振,XSHO25000FC1H-H,HSX530G无源晶体.

6G无线通信晶振,加高陶瓷晶振,XSHO25000FC1H-H,HSX530G无源晶体参数表

TYPE
ITEM

HSX530G

Frequency Range

8 ~ 10 MHz

10 ~ 20 MHz

20 ~ 27 MHz

27 ~ 50 MHz

Mode

Fundamental

Frequency Tolerance

±30ppm , ±50ppm (at. 25℃)

Frequency Stability over
Operating Temperature Range

±30ppm, ±50ppm, or Specify

Operating Temperature

-10 ~ +60℃, or Specify

Load Capacitance

Series, 8pF, 10pF, 12pF, or Specify

Drive Level

10μW (300μW Max.)

Equivalent Series Resistance

150Ω Max.

100Ω Max.

80Ω Max.

50Ω Max.

Storage Temp. Range

-40 ~ +125℃

6G无线通信晶振,加高陶瓷晶振,XSHO25000FC1H-H,HSX530G无源晶体 尺寸图

陶瓷晶体产品特性：

非常低的老化

优异的耐热性和抗冲击性

频率范围8MHz-50MHz（基本模式）

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X2C025000DZ1H-U	HSX211S	HELE加高晶振	HSX211S/25MHZ/6PF/20PPM/20PPM@-3	25.000MHZ	±20ppm
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X5H025000FK1H-X	HSX530G	HELE加高晶振	SMD Crystal Resonators SMD_5032-2P RoHS	25.000MHZ	-
X5H008000FF1H	HSX530G	HELE加高晶振	SMD Crystal Resonators SMD-5032-2P RoHS	8.000MHZ	-
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X2CO40000BD1H-HZ	HSX211S-AU	HELE加高晶振		40.000MHZ
X2CO27120FC1H-HX	HSX211S-AU	HELE加高晶振		27.120MHZ
XSHO25000FC1H-H	HSX530G	HELE加高晶振		25.000MHZ
XSHO12000FG1H-X	HSX530G	HELE加高晶振		12.000MHZ
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X1H024576DK1H-X	HSX531S	HELE加高晶振		24.576MHZ
X1H012000BC1H-X	HSX531S	HELE加高晶振		12.000MHZ
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X1H022118DW1H	HSX531S	HELE加高晶振		22.1184MHZ
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